1SS400T1G, NSV1SS400T1G
http://onsemi.com
3
PACKAGE DIMENSIONS
SOD?523
CASE 502?01
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO-
TRUSIONS, OR GATE BURRS.
E
D
?X?
?Y?
2X
b
0.08
M
X
Y
A
HE
c
DIM MIN NOM MAX
MILLIMETERS
D
1.10 1.20 1.30
E
0.70 0.80 0.90
A
0.50 0.60 0.70
b
0.25 0.30 0.35
c
0.07 0.14 0.20
L
0.30 REF
HE
1.50 1.60 1.70
12
*For additional information on our Pb?Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
RECOMMENDED
TOP VIEW
SIDE VIEW
2X
L2
BOTTOM VIEW
2X
L
2X
0.48
2X
0.40
1.80
DIMENSION: MILLIMETERS
PACKAGE
OUTLINE
L2
0.15 0.20 0.25
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e changes without further notice
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arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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